Project: Numerical Simulation of a Cooling Device

Overview

The aim of this project is to develop a C++ program to study the thermal behavior of a microprocessor cooling device. One common method for regulating the temperature of a processor is by using a fan. The airflow helps to dissipate heat through convection on the processor’s surface. To enhance this process, the processor is typically attached to a heatsink (composed of several fins), which is a highly heat-conductive element. This additional device, increases the exchange surface with the airflow, thus effectively cooling the electronic component.

Installation

1. Clone the repository:

git clone https://github.com/GiulioCrp/HeatFin.git

1. Navigate to the project directory:

cd HeatFin

Build the project

Configure and build the project using CMake:

mkdir build
cd build

# Build the project
cmake ..

# Compile the project
make

# Run the tests
make test

Usage

cd build
./run

The results will be saved in the /results directory which is automatically created if needed.

Contributors

• giuliocrp